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Views: 0 Author: Site Editor Publish Time: 2024-07-01 Origin: Site
1. Epoxy resin has the characteristics of high mechanical properties, dense chemical structure and strong cohesion, so epoxy resin adhesive has excellent bonding properties.
2. The volume shrinkage and linear expansion coefficient of epoxy resin are small, so this adhesive has small internal stress and strong processability.
3. Epoxy resin basically does not produce low molecular weight volatiles when curing, so its electrical properties are good.
4. Epoxy resin does not contain impurities such as salt and alkali, so the possibility of deterioration is extremely low, so it has extremely strong stability.
5. However, epoxy resin has general heat resistance and has low adhesion to materials with low polarity (such as PP, PP, fluoroplastics, etc.). Surface activation treatment must be performed first.
1. Polyurethane has a wide hardness range, high mechanical properties, and high wear resistance and impact resistance, giving polyurethane adhesives the same properties.
2. Polyurethane adhesives have excellent flexibility and elasticity under low temperature conditions.
3. Polyurethane adhesives have good weather resistance, oil resistance, and aging resistance.
3. However, due to the special chemical structure of polyurethane, polyurethane adhesives cannot be used in high temperature and high humidity environments during the bonding process.
Silicone adhesive is the most widely used adhesive on the market.
1. Silicone has excellent electrical properties, a wide temperature range, good flexibility and low stress.
2. Silicone does not release heat during curing, has low toxicity and small shrinkage after curing, which is deeply loved by workers who use adhesives.
3. Silicone has stable chemical properties and is corrosion-resistant.