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Preparation Method of New Adhesive

Views: 0     Author: Site Editor     Publish Time: 2024-06-27      Origin: Site

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  1. A pressure-sensitive hydrogel adhesive and its preparation method and application.

    On June 25, according to the announcement of the State Intellectual Property Office, the publication date of an invention application of the Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences is June 25, 2024, and the application date is May 10, 2023. The application publication number is CN118240509A. The abstract shows that the present invention provides a pressure-sensitive hydrogel adhesive and its preparation method and application. The preparation method comprises: subjecting a uniformly mixed reaction system comprising a hydrophobic organic monomer, a surfactant, a hydrophilic organic monomer, a thermal initiator, a polyoxometallic acid and/or a polyoxometallic acid salt, and water to a thermally initiated polymerization reaction to obtain a block hydrogel; then infiltrating the block hydrogel with a polyvalent metal solution containing a polyvalent metal cation to obtain a pressure-sensitive hydrogel adhesive. The present invention synthesizes the hydrogel body by using a hydrophilic organic monomer and a hydrophobic organic monomer, uses a polyoxometallic acid salt as a cross-linking agent, and then soaks it in a polyvalent metal ion solution. The hydrophilic and hydrophobic groups on the surface of the hydrogel migrate and rearrange, and have the function of excluding the interfacial liquid. The prepared hydrogel adhesive has strong adhesion in a variety of organic and inorganic liquid environments.

  2. An Epoxy adhesive and its preparation method .

    On June 25, according to the announcement of the State Intellectual Property Office, the publication date of an invention application of China National Petroleum Corporation is June 25, 2024, the application date is December 24, 2022, the application publication number is: CN118240513A, and the abstract shows that the invention belongs to the technical field of epoxy adhesives, and specifically relates to an epoxy adhesive and a preparation method thereof. It includes epoxy resin, toughening agent, curing agent and accelerator; the weight proportion of the epoxy resin is 100 parts; the weight proportion of the toughening agent is 1 to 10 parts; the weight proportion of the curing agent is 90 to 160 parts; the weight proportion of the accelerator is 0.5 to 3 parts. The present invention reduces the curing temperature of the epoxy adhesive, accelerates the curing speed, and improves the high-temperature resistance of the adhesive by adding an epoxy resin with a self-catalytic effect, a high-functionality heat-resistant curing agent, and a high-activity accelerator that has both accelerator and curing agent effects. When the adhesive is used in a high-temperature environment, part of the accelerator can participate in the curing reaction of the epoxy resin together with the curing agent to increase the crosslinking density and further improve the heat resistance of the epoxy adhesive.

  3. A fire-resistant adhesive and its production method.

    On June 25, according to the announcement of the State Intellectual Property Office, the publication date of an invention application of Hunan Zhongye New Materials Co., Ltd. is June 25, 2024, the application date is March 15, 2024, the application publication number is: CN118240511A, and the abstract shows that the present invention discloses a fire-resistant adhesive and a production method thereof, comprising the following steps: adding phenol, sodium hydroxide and water into a reactor, heating to 60°C; adding 1/6 paraformaldehyde into the reactor, controlling the temperature in the reactor to 75-95°C; and then adding the molten salt to the reactor at a certain interval. The same amount of paraformaldehyde as the first time is added multiple times; the temperature in the reactor is controlled at 85-95°C for a certain period of time, and then the temperature is raised to 95-110°C for reaction; the temperature in the reactor is lowered to 55-60°C, and γ-aminopropyltriethoxysilane is slowly dripped into the reactor to obtain γ-aminopropyltriethoxysilane-modified phenolic resin; the above-mentioned γ-aminopropyltriethoxysilane-modified phenolic resin, water and inorganic refractory fiber are added to a stirring barrel, after the first stirring, a silicon-containing inorganic filler is added, and after the second stirring, the material is discharged to obtain a refractory adhesive. The present invention has the advantages of fire resistance and high bonding strength.


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